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Blog
Upcoming Coextrusion Technical Meeting
August 20, 2008
Hello, I'd like to take this opportunity to make you all aware of an upcoming technical conference relating to coextruded substrates for film and sheet. It is the Society of Plastics Engineers Topical Conference on Coextrusion (SPE Co-Extrusion TopCon) to be held on Oct. 20-21 in Cincinnati.
The TopCon program has been developed by the Extrusion Division of SPE and picks up on a tradition of leading conferences on coextrusion, which were conducted in the 1980-1990 timeframe when coextrusion was becoming widely practices but was still a mystery to many in the film and sheet industry. While great strides have been made in equipment and understanding there is always something new to learn. We have two pioneers in coextrusion opening the program each day, Frank Nissel and Peter Cloeren, Jr., discussing the history and application of coextrusion. In addition, topics will cover the use of feedblocks, coextruded profiles, blown and cast films, the use of barrier resins, adhesive resins and resin selection. Also, to be covered are the important topics of melt rheology, coextrusion rheology and it application and impact on the coextrusion process and products. You can review the brochure of the program at:
http://www.4spe.org/conf/coext08/coext08brochure.pdf
You can find program and registration information at the SPE web site with the following link,
http://www.4spe.org/conf/coext08/coext08.php
So, mark your calendars, and I hope to see all of you there.
Posted by Eldridge M. Mount on August 20, 2008 | Comments (0)