Adhesive application

-- Converting Magazine, 3/1/2001

Booth 20073

DynafiberT UFD is a new hot melt adhesive application technology, patent pending. It is said to achieve a better bond strength with less adhesive. Random fiber or oscillating adhesive patterns are possible. This hot melt eliminates nozzle orifice plugging and contains the lowest CFM requirements available.

ITW Dynatec, 800/860-6150, fax: 615/264-5248, www.itwdynatec.com

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