Converters of paper, paperboard, corrugated, plastics, laminates, rubber, composites and more will find practical diemaking, diecutting and foil stamping/embossing solutions at the 2007 IADD/FSEA Odyssey (www.iadd.org/odyssey) May 2-4 at the Midwest Airlines Ctr. in Milwaukee.

Sponsored by the International Association of Diecutting and Diemaking (IADD) and the Foil Stamping and Embossing Association (FSEA), the Odyssey offers three days of educational sessions, both in the classroom and on the Techshop™ floor, designed to educate, solve challenges and foster open discussion. In addition to seminars, Odyssey attendees can partake of a three-day exposition and networking opportunities with industry experts and peers.

A sampling of the 2007 lineup includes: Diecutting, Nicking, Rubbering, and Communication; Working with Hard-to-Stamp Surfaces; Foil Stamping/Diecutting Plastics; Working with Foil on Tight Registration; Traditional Rotary Rubbering vs. Water Jet; Laser 101–Cutting Problems and Solutions; and Troubleshooting Static.

“On both the diecutting/diemaking and foil stamping/embossing sides, nearly every major supplier of equipment, materials, hot-stamping foils, and engravings will be represented at the 2007 Odyssey,” says FSEA executive director Jeff Peterson.