Pack the halls in Chicago

The biennial Pack Expo Intl., teamed with the second edition of CPP Expo, will celebrate its 50th anniversary.

By Associate Editor Jorina Fontelera -- Converting Magazine, 10/1/2006

More than 50,000 industry professionals from around the globe will flock to Chicago's McCormick Place Complex this month to investigate the latest and greatest in the world of packaging at Pack Expo International 2006. To add to the buzz of new technology and industry news Oct. 29-Nov. 2, Pack Expo is also celebrating its 50th anniversary.

“The 50th anniversary of Pack Expo is a great milestone,” says Charles Yuska, president of show organizer Packaging Machinery Manufacturers Institute (www.pmmi.org). “The show's longevity can be attributed to its consistent future focus.”

Pack Expo promises not to disappoint by focusing on the latest developments in packaging machinery, converting machinery, raw and finished materials, flexible packages, rigid containers, and components. With over 1,600 companies exhibiting, attendees will have no shortage of new technology to sample now and for the future.

Specialty pavilions

Attendees who prefer to immerse themselves in one specific packaging topic can also visit the targeted pavilions at the show.

Brand Protection Center: This pavilion will focus on packaging initiatives and technologies to protect against bioterrorism, package tampering, counterfeiting and product alteration. Visit packaging security exhibits from technology and service providers as well as government stakeholders.

Contract Packaging Pavilion: The prominence of contract packaging services in today's vibrant marketplace is recognized by this new attraction. The pavilion is a great starting point for assessing a project and exploring the many possible options provided by contract packaging partners.

Containers & Materials Pavilion: Debuted at Pack Expo Las Vegas 2003, this successful pavilion was increased by 33 percent in 2005 to satisfy higher exhibitor demand. More than 40,000 sq ft of exhibit space will be dedicated to the latest innovations in materials, containers and converting machinery this year.

RFID Pavilion: The Radio Frequency Identification (RFID) Pavilion will again highlight solutions that meet the requirements of the entire supply chain. Exhibits include technologies to upgrade conventional lines into RFID-enabled packaging lines capable of applying multi-pack, case and pallet tags online. Also view the latest advances designed to verify the presence of tags, write to the tags and validate tag data.

And just for the thousands of converters expected to attend, the second edition of CPP (Converting and Package Printing) Expo will be co-located with Pack Expo Intl. for the first time. See Converting's preview of the converting-focused show in our September 2006 issue.

Specifics:

WHAT: Pack Expo International 2006, CPP Expo 2006

WHERE: McCormick Place Complex, Chicago

WHEN: Oct. 29-Nov. 1—9:00 a.m.-5:00 p.m. Nov. 2—9:00 a.m.-2:00 p.m.

MORE INFO: www.packexpo.com

Pack Expo Intl. Conference Program

Tap into what has the packaging industry abuzz by attending various Pack Expo Intl. 2006 conference sessions. Below is a sampling of topics relevant to converters. Also, check out specific CPP Expo conference sessions; an abridged list is available in our September 2006 issue, page 28.

Oct. 30

Resolving the technical challenges of RFID tagging of liquids and metal packaging: Focuses on various RFID solutions built for use with metals or fluids, including information on a new R&D program aimed at developing UHF RFID tags for single-item metal packaging.

Barcodes vs. RFID—Can they coexist?: Explores the types of applications where one technology should be selected over the other.

Enhancing brand identity and value through shrink labeling: Discussion on options and advantages of shrink labels. Market growth for shrink labels is expected to be 20 percent a year for the next five years.

Oct. 31

Creating a sustainable future—Growing the bioresin market in a greening economy: Discussion on how to bring bioresin to market and the required technical expertise in understanding fit-for-use applications of a new material.

Creating value in the shrink-body label market—Innovating for the entire value chain: Demonstrates the importance of resin suppliers meeting the needs of customers and the entire value chain.

Smart packaging—How smart is it and where is it going?: Focuses on time/temperature indicators and thermochromatic inks.

Future potential challenges for graphic corrugated packaging: Provides insight on developments shaping the North American graphic corrugated market and how these will affect producers, converters, distributors and end-users.

Layering anti-counterfeiting at every level to discourage attack on your product: Talks about the approach and methods that have proven successful across world markets.

The innovative and sustainable advantages of new paper-based barrier pouch and lidding materials: Discusses how enhanced oxygen, MVTR and aroma barrier properties, combined with price stability and print receptivity, are creating a whole new section of barrier paper pouch materials.

Biopolymer shrink sleeves—The final frontier for shrink sleeve labeling: Focuses on how biopolymers are just as good, and often better, than petrochemical-based films when it comes to machining, printing, product finishing and overall appearance.

Nov. 1

The Wal-Mart/Sam's Club Packaging Vision: Keynote presentation on the company's packaging innovations and how they relate to consumer and environmental trends.

Chipless RFID label technology presentation: Updates on advances with new chipless RFID label development.

Paper label design strategies—Product lifecycle optimization: Teaches how label application methods and product lifecycle expectations influence label design and how these design factors have implications on the overall operational efficiency of label conversion.

Innovations in package printing—Thermoformed packs, closures with taste and sensory packaging: Gives an overview of innovations in package printing just now hitting the market.