The global smart packaging market will grow to $14.1 billion in 2013, according to a just-released report from Glen Allen, VA-based NanoMarkets LC (www.nanomarkets.net). The study examines emerging market opportunities stemming from new developments in materials and electronics.

Printable electronics enables smarter packaging, NanoMarkets says. Only printing can deliver sophisticated electronic capabilities to packaging at a price that makes the next generation economically viable. Smart packaging will account for over $1.1 billion in printable-electronics components by 2011.

New power sources enabling smart packaging. Help is coming from three sources: piezoelectric materials, organic photovoltaics and thin-film batteries.

Smart packaging needs smart materials. Among potential opportunities: thermochromic inks to show when an optimal (or dangerous) temperature has been reached; shape memory alloys to control package opening and closing depending on environmental conditions; piezoelectrics to power lighting and audio features on packaging; and smart adhesives on smart labels to ensure freshness through color changes.

Smarter packaging means fewer fakes. In anti-counterfeiting efforts, a combination of RFID authentication at point-of-sale, security inks and other smart packaging will make a major contribution to combating counterfeiting.