Originally organized by the Intl. Association of Diecutting and Diemaking (Crystal Lake, IL) for its first two iterations, the Odyssey trade show expands its horizons for 2005 with help from the Foil Stamping and Embossing Association (Topeka, KS).

The program, set for June 15–17 at the Cobb Galleria Center in Atlanta, now encompasses all the converting technologies and products related to diecutting, diemaking, foil stamping, embossing and holography.

A combination of Techshop™ training sessions, live equipment demonstrations, and nearly 100 exhibitors in the Technology Hall is planned to give attendees real-time solutions to folding-carton, trade-finishing, and corrugated-converting challenges.

Odyssey 2005 kicks off June 15 with a keynote address by Mike Rehnwinkel, senior vice president for packaging at Georgia-Pacific, speaking on "The State of the Packaging Industry." Thirty industry-specific educational workshops on a broad range of topics over the next three days are intended to help converters improve efficiency, productivity and the bottom line. Among the subjects are "Evolving into the Digital Age," "Lean Manufacturing," "In-House Repairs" and "Analyzing Your True Costs."

Two gala awards banquets will honor industry veterans during Odyssey 2005.

The FSEA Gold Leaf Awards Banquet, to be held June 15 at the Renaissance Waverly ©14 § 10 Hotel in Atlanta, will recognize winners of the 2004 Gold Leaf competition as well as present the 2005 FSEA Lifetime Achievement Award to Hank Brandtjen Jr., president of Brandtjen & Kluge, Inc.

The IADD Gala Awards Banquet on June 16 at the Cobb Galleria will honor Robert A. Larson, president of Larson Worldwide, Inc., at a reception, and present the 2005 IADD Lifetime Achievement Award to Eugene C. Piette, founder of Piette Dieboards.

More info: 800/828-4233, fax: 815/455-7510, www.iadd.org, www.fsea.org