Full house for OMET-Esko Future of Flexo seminar
Prepress, printing technology event draws 60 participants to Clemson's Sonoco Packaging Institute.
PRESS RELEASE -- Converting Magazine, 11/9/2009 7:19:47 PM
Judging by the the number of attendees and their comments, The Future of Flexo seminar presented by OMET & ESKO at the Sonoco Packaging Institute at Clemson University was a huge success.
A capacity crowd of 60 participants jammed into the Packaging Institute (right) to hear about the latest technologies from an assortment of suppliers, learn about expanded gamut printing from the two featured speakers as well as view hi-def and expanded-gamut packaging-printing running on the OMET Varyflex press.
Attendees heard from and had hands-on demos from the following sponsors and their new technologies:
-ESKO - Equinox expanded gamut & Hi-Def software
-Harper Corp. of America - QD proofing system
-Environmental Inks - Fastmatch color management system
-Flint Group - Ultra-thin plates
-Anderson-Vreeland - Plate measurement devices
-OMET - Varyflex press with low waste, quick-change features running three different jobs on two different substrates.
